2020年华为、小米、OPPO、vivo快速入局TWS耳机领域,并且将从高、中、低端全面布局TWS耳机产品线。如何扩建TWS+ANC生产线成为竞争的关键。

出门问问目前是少数具备AIOT底层软硬结合开发能力的公司,通过核心算法与硬件处理平台深度融合,打造TWS耳机通话降噪解决方案。
瑞勤电子的TWS ANC降噪硅麦目前多应用于品牌厂商。
美格信在ANC降噪检测领域属于先行者,是业界知名ANC降噪测试设备厂家。

  • The company’s Wi-Fi and Wi-Fi/Bluetooth combo solutions are pre-integrated across its i.MX RT MCU platform, allowing developers to create the optimal pairing of processing with connectivity
  • NXP combines its MCU and Wi-Fi/Bluetooth platform solutions within its MCUXpresso Software Development Kit (SDK) to simplify and accelerate IoT product development
  • Connectivity modules and MCU development kits are available now through NXP’s extensive distribution network
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