I. System Architecture

1. Text Description

The system adopts a three-layer architecture: Perception Layer, Control Layer, and Application Layer.

• Perception Layer
  • Flexible SBR Fabric Sensor: Embedded in seats or mattresses to collect signals such as posture, body movement, bed exit status, and respiration.
  • NTC Temperature Sensors: Arranged at multiple points on the heating pad surface for real‑time temperature monitoring.
  • Environmental Sensors (optional): Temperature, humidity, and light sensors for adaptive control.
• Control Layer
  • Signal Conditioning Circuit: Amplification, filtering, and analog‑to‑digital conversion.
  • Microcontroller Unit (MCU): Runs embedded algorithms to process sensor data, execute PID temperature control, and detect abnormal events.
  • Drive Circuit: MOSFET or relays to control the power supply to the graphene heating pad.
  • Communication Module: Wi‑Fi / Bluetooth / LoRa / 4G for uploading data to the cloud and receiving remote commands.
• Application Layer
  • Cloud IoT Platform: Device management, data storage, and rule engine (e.g., bed‑exit alarm, automatic heating).
  • Mobile App / Mini‑Program: Provides real‑time status, push notifications, and remote temperature adjustment for family members or caregivers.
  • Institution Management Dashboard: Centralized monitoring for multiple beds, energy consumption statistics, alarm logs, and report export.

With the in-depth iteration of Internet of Things (IoT) technology, Bluetooth, as the core carrier of short-range wireless communication, is ushering in a technological revolution represented by Bluetooth 6.0/6.2. Compared with previous protocols, Bluetooth 6.0/6.2 achieves breakthroughs in Channel Sounding (CS), ultra-low latency and security protection. Coupled with the audio experience upgrade of LE Audio (Low Energy Audio) and the networking expansion of BLE Mesh, it has become the core technical standard for consumer electronics, smart mobility, smart home and healthcare in 2026.

This paper focuses on three mainstream scenarios: Automotive, Smart Home, and Wearable & Medical Healthcare. It dissects complete application solutions, technical details, typical architectures and deployment effects, with precise chip/module selections and brand models, providing a full-dimensional reference for industry R&D, selection and mass production.

On March 18, the "Intelligence Leading the Future – 2026 AI Application and Robot Innovation Industry Conference" kicked off at Beijing’s Beizhongyuan Exhibition Center. Bringing together over 100 leading companies from the AI and robotics sectors, the event not only showcased the latest technological breakthroughs but also laid bare the industry’s most pressing tension: an insatiable hunger for computing power set against a backdrop of severe supply chain constraints.

From GPU leasing services to AI-optimized storage servers, from precision robot actuators to advanced materials like bionic skin, a rapidly expanding industrial chain was on full display. Throughout the exhibition floor, phrases like "out of stock," "price hikes," and "extended lead times" echoed in conversations between exhibitors and potential buyers.

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